
Artificial Intelligence has shifted from the data centre to the edge. The AI of Things (AIoT) is no longer a buzzword but a core engineering reality. From smart homes and industrial automation to ADAS in EVs and autonomous robotics, the demand for localised intelligence is driving innovation in embedded hardware.
Design engineers are on the frontlines of this transformation. Their role is to bring intelligence directly into end products by tackling the challenges of running AI workloads on constrained devices, while selecting the right SoCs, SOMs, and development kits that make edge intelligence both practical and deployable.
Why Running AI on Edge Devices is Challenging
Cloud-based AI models thrive on massive compute and storage. Edge devices must instead meet:
- Low latency – milliseconds matter for robotics, ADAS, or production line defect detection.
- Bandwidth efficiency – sending raw video/audio data to the cloud is expensive and impractical.
- Privacy and security – facial images, health signals, and voice commands often cannot leave the device.
- Power and cost budgets – embedded AI must fit into fanless boxes, battery-powered nodes, and cost-sensitive consumer devices.
The solution is localised AI models accelerated by NPUs, DSPs, FPGAs, or ultra-low-power Neural Network engines. These accelerators allow real-time inference without draining power or requiring cloud connectivity.
Design engineers play a critical role in selecting the right development kits and reference platforms, bridging high-level AI concepts with deployable hardware solutions.
AI-Capable Dev Kits and Boards
The transition from cloud-centric AI to edge intelligence would not be possible without a new generation of AI-ready hardware platforms. These development kits and boards serve as the practical foundation for design engineers, offering a balance of compute performance, energy efficiency, and integration flexibility. More than just processors, they bundle together optimised silicon, software frameworks, pre-trained models, and peripheral interfaces, effectively reducing the complexity of deploying AI workloads on constrained devices. Whether the goal is ultra-low-power keyword detection in a wearable or high-performance machine vision in industrial automation, these kits provide the building blocks that turn AI concepts into deployable products. Let's explore the most advanced AI-capable devkits and SBCs to stay ahead of the game.
AMD Kria™ K24/K26 SOMs & Starter Kits
- Kria Range K24/26: Built on Zynq™ UltraScale+™ MPSoC: Arm Cortex-A53 + R5F cores with programmable FPGA fabric.
- The FPGA enables custom accelerators such as Xilinx’s DPU, ideal for CNN inference and video pre-processing.
- KV260 Vision AI Starter Kit: delivers up to 3× higher AI throughput per watt than many SOMs.
- Primary use cases: industrial machine vision, robotics, ADAS prototyping, and deterministic real-time analytics.

NXP: Broad Spectrum of AI Solutions
- FRDM-MCXN947: Cortex-M33 MCU + NPU for tinyML and anomaly detection in motor drives, HVAC, and appliances.
- FRDM-IMX93: Cortex-A55 + Ethos-U65 MicroNPU; well-suited for driver monitoring, voice assistants, and smart hubs.
- SLN-VIZN3D-IOT: Secure 3D facial authentication with anti-spoofing.
- SLN-SVUI-IOT: Optimized for wake-word + command recognition.
- SLN-TLHMI-IOT: Turnkey multimodal HMI kit with face, gesture, and voice recognition.
- NXP’s strength lies in reference kits that are nearly production-ready, reducing integration risk.

STMicroelectronics: From TinyML to Industrial AI
- STM32N6570-DK: Cortex-M55 MCU optimized for ML instructions; ideal for low-power audio or vibration analytics.
- STM32MP257F-DK: Heterogeneous Cortex-A35 + Cortex-M33 MPU with integrated NPU, supporting Linux AI frameworks for industrial HMIs.
- STEVAL-BFA001V2B: Condition monitoring and predictive maintenance kit, featuring multi-sensor integration and ML-based anomaly detection.

Analog Devices: Pioneers in Ultra-Low-Power AI
- MAX78000EVKIT / MAX78000FTHR: MCU with a dedicated CNN accelerator, enabling face and keyword recognition at micro-watt levels.
- MAXREFDES178#: Complete audio + vision AI reference design.

Raspberry Pi 5 & Compute Module 5
- Raspberry Pi 5 and CM5: Based on a quad-core Cortex-A76 at 2.4 GHz with significant uplift in memory bandwidth and GPU performance.
- Strong community support makes it a go-to for vision AI, robotics, and edge analytics prototyping.
- Compatible with accelerators like Google Coral TPU and Intel Myriad X, enabling license plate recognition, person detection, and smart surveillance.
- Compute Module 5 (CM5) brings Pi 5’s performance into production-ready SOM form, perfect for embedded industrial and consumer products.

Arduino Portenta & Nicla Sensors
- Arduino Portenta H7 / X8: Dual-core MCUs/MPUs supporting TensorFlow Lite and MicroPython, ideal for connected IoT + AI workloads.
- Arduino Nicla Sense ME: Tiny sensor-rich module with IMU, gas, humidity, and barometer—optimized for ML-based condition monitoring and environmental sensing.
- Portenta + Nicla ecosystem bridges prototyping and production, letting developers scale from proof-of-concept to deployable solutions.
- Community-driven software and accessible APIs lower the barrier to entry while maintaining professional-grade hardware reliability.

Hardware Comparison Matrix
|
Platforms |
CPU / MPU |
AI / Acceleration |
Power Class |
Key Applications |
|
AMD Kria K24/K26 SOM |
Quad Cortex-A53 + R5F, FPGA fabric |
Programmable DPU for CNN/vision |
5–15 W |
Robotics, industrial vision, ADAS prototyping |
|
NXP FRDM-MCXN947 |
Dual Cortex-M33 |
NPU-class DSP instructions |
<1 W |
TinyML, anomaly detection, IoT sensors |
|
NXP FRDM-IMX93 |
Dual Cortex-A55 + Cortex-M33 |
Arm Ethos-U65 MicroNPU (0.5 TOPS) |
2–5 W |
Driver monitoring, voice hubs, edge AI gateways |
|
NXP SLN-VIZN3D-IOT |
Cortex-M7 MCU |
Vision/3D depth + secure engine |
<2 W |
Secure face authentication |
|
NXP SLN-SVUI-IOT |
Cortex-M7 MCU |
Local voice/keyword engine |
<2 W |
Wake word + voice UI |
|
NXP SLN-TLHMI-IOT |
Cortex-M7 MCU |
Vision + audio fusion |
<2 W |
Touchless HMI (gesture + voice + face) |
|
ST STM32N6570-DK |
Dual Cortex-A35 + Cortex-M33 |
GPU/NEON for ML ops |
1–3 W |
Smart HMI, audio ML, low-power edge |
|
ST STM32MP257F-DK |
Dual Cortex-A35 + Cortex-M33 |
Integrated NPU (~0.5 TOPS) |
3–6 W |
Linux AI frameworks, industrial automation |
|
ST STEVAL-BFA001V2B |
Cortex-M4 MCU |
ML on sensor fusion pipeline |
<1 W |
Predictive maintenance, vibration monitoring |
|
Analog Devices MAX78000EVKIT |
Arm Cortex-M4F MCU |
CNN accelerator (AI at µW) |
<0.5 W |
Keyword spotting, face recognition in wearables |
|
Analog Devices MAXREFDES178# |
MAX78000 SoC |
CNN + audio DSP |
<0.5 W |
Audio + vision reference design |
|
Raspberry Pi 5 |
Quad Cortex-A76 2.4GHz |
Broadcom VideoCore VII GPU; optional Coral TPU |
5–15 W |
Robotics, surveillance, smart cameras |
|
Raspberry Pi Compute Module 5 |
Same as Pi 5 |
External accelerator support (TPU/Myriad X) |
Configurable 5–15 W |
Embedded production designs |
|
Arduino Portenta H7/X8 |
Dual Cortex-M7 + M4 (H7), or Linux MPU (X8) |
TensorFlow Lite Micro + HW DSP |
<2 W |
IoT AI, smart gateways |
|
Arduino Nicla Sense ME |
Cortex-M4F MCU |
Sensor fusion + ML at edge |
<0.5 W |
Environmental monitoring, predictive maintenance |
Why These Kits Matter
Across vendors, these dev kits share common enablers for engineers:
- Pre-optimized models for facial recognition, keyword spotting, anomaly detection.
- Model optimization toolchains: quantization, pruning, and INT8/FP16 inference runtimes.
- Peripheral-ready interfaces: camera inputs, audio front ends, multi-sensor stacks.
- Ecosystem alignment: TensorFlow Lite, PyTorch Mobile, ONNX runtimes, and vendor-specific SDKs (OpenVINO, Ethos-U, DRP-AI equivalents).
This ecosystem allows design engineers to make complex technologies deployable, reducing developer friction while accelerating time-to-market.
Applications Across Industries
Closing Thoughts
The move from cloud-first AI to localised edge AI is reshaping embedded system design. For design engineers, the key challenge is balancing performance, power, and cost in real-world deployments.
This is where AI-focused development kits and reference platforms make a difference. They abstract hardware complexity, provide optimised software stacks, and offer tested use cases - enabling engineers to move faster from concept to deployable product.
Farnell, as a leading global electronics distributor, carries all these kits and many more, along with technical documentation, design resources, and application notes, making the engineer’s journey simpler and more efficient. The hardware revolution is here, and Farnell aims to accelerate learning and empower engineers to turn AI concepts into real-world designs. At the edge of innovation, it’s not just about what AI can do - it’s about what you can do with AI.
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